ormalized) V DS, Drain-to-Source Voltage (V) Fig 5. Typical Output Characteristics 2.0 ID = 13A V GS = 10V V GS = 4.5V 1.5 ID, Drain-to-Source Current (A) 10 TJ = 150.

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6722MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET pack.

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